Product Brands

High Resolution 3D Surface Non-Contact Measurement Systems

Laser Range Finder

Leader in Wafer AOI and Precision Grinding in Semiconductor Advanced Packaging

Precision Machining in Semiconductor Advanced Packaging

Leader in Thermal and UV Light Process Equipment since 1966

Wafer Inspection Systems

High End 3D CT X-Ray

Microscopy Solution - More than Microscopy

Reflow Simulator for Observation and Measurement

Auto and Accurate Bond Tester

Scanning Acoustic Microscopy Analytical Systems

eviXscan 3D is a brand of high quality scanners based on structured light technology

Microwave Plasma Decapsulation System

Nikon XTV160 Xray

Reliable High Speed Test Handlers since 2011

Electron Microscope Supplies

Full solution of Metallography, Metallurgical Testing, Microstructural Analysis

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  • Laser Products

Erbium Doped Glass Laser

Laser Range Finder


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  • cyberTECHNOLOGIES

CT 350

Non-contact profilometer with a 350 x 350 XY scanning area


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  • UHS 3D CT Xray

XVA 160RZ

High resolution 3D X-ray CT system Versatile MicroFocus model, perfect for inspection & analysis of SMT boards or other items.


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  • UHS 3D CT Xray

XVA 160 Alpha II Z

3D X-ray CT system High-end Nano-focus model, ideal for inspection & analysis of semiconductors & electronic components.


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  • Muegge

STP 2005

Plasma Decapsulation Tool Microwave Plasma System with integrated Remote Plasma Source


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  • PVA TePla SAM

SAM 302 TWIN

SAM system that utilizes arrays of two transducers to acquire simultaneous acoustic images


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  • PVA TePla SAM

SAM 301 HD2

Most popular customer choice for high performance failure analysis in both production and R&D environments


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  • Muegge

STP Compact DeCap

Compact Microwave Plasma Decapsulation System


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  • Motic

Easy Zoom Digital Microscope

A flexible, high performance digital microscope that is well suited for material inspection. The microscope offers 50x to 5800x magnification in a single zoom body, providing extreme versatility and making it a great fit for any application.


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  • TRY Precision

ABT2000C

Fully Automatic Bond Tester for Wire Pull, Ball Shear , Die Shear with Automatic Leadframe/Substrate Loader


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  • CSUN

Vacuum Pressure Oven

Model : VPO-2D


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  • cyberTECHNOLOGIES

CT 300

Non-contact profilometer with a 315 x 315 XY scanning area


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  • GMM

Chip Sorter

Model: KS 856


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  • GPM

Wafer AOI

AOI in Wafer 2D Inner Crack for Silicon or Glass