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HW Wafer AOI 5510

Brand: Symphony AOI


Applied to shipment after wafer cutting/post-seal cutting, it detects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency


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Project

Content

Product Type

6", 8", 12" frame wafer

2D Inspection ltems

scratches, foreign objects, dirt, damage, offset of the position of the needle mark, excessive needle mark, damage to the pad and other appearance defects, cracks

Cutting Path  

Inspection Items

6", 8", 12" frame cassetee

Lens and

Resolution

2x?2.75um?/3.5x?1.57um?/

5x?1.1um?/7.5x?0.73um?/10x?0.55um?

Precision

0.55μm/pixel

Optional and Customized

INK module,  IR module