Applied to shipment after wafer cutting/post-seal cutting, it detects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency
Project |
Content |
Product Type |
6", 8", 12" frame wafer |
2D Inspection ltems |
scratches, foreign objects, dirt, damage, offset of the position of the needle mark, excessive needle mark, damage to the pad and other appearance defects, cracks |
Cutting Path Inspection Items |
6", 8", 12" frame cassetee |
Lens and Resolution |
2x?2.75um?/3.5x?1.57um?/ 5x?1.1um?/7.5x?0.73um?/10x?0.55um? |
Precision |
0.55μm/pixel |
Optional and Customized |
INK module, IR module |