Applied after final test, it can detect appearance defects in encapsulated devices by patented 2D/3D vision inspection system.
Project |
Content |
Product Type |
LGA、QFN、BGA、QFP、SOP |
2D Inspection |
Cracks, adhesive residue, damage, abnormal solder balls, foreign objects, positional accuracy of solder balls |
3D Inspection |
BGA height, coplanarity, etc |
Tray and transmission method |
JEDEC standard tray |
Product Size |
3mmX3mm-120mmX120mm |
Support Incoming Materials |
Tray to Tray&Tray to Reel |
2D Visual System |
25MP |
Pixel Resolution |
10μm/pixel |
Optional and customized |
5S/3D/Reel modules |