Automatic Optical Inspection (AOI)
Precision Machining in Semiconductor Advanced Packaging
Leader in Thermal and UV Light Process Equipment since 1966
High Resolution 3D Surface Non-Contact Measurement Systems
Laser Range Finder
Auto and Accurate Bond Tester
Microscopy Solution - More than Microscopy
High End 3D CT X-Ray
Wafer Inspection Systems
Reflow Simulator for Observation and Measurement
Scanning Acoustic Microscopy Analytical Systems
Nikon XTV160 Xray
Reliable High Speed Test Handlers since 2011
Microwave Plasma Decapsulation System
eviXscan 3D is a brand of high quality scanners based on structured light technology
Electron Microscope Supplies
Full solution of Metallography, Metallurgical Testing, Microstructural Analysis
Leader in Wafer AOI and Precision Grinding in Semiconductor Advanced Packaging
Applied to shipment after wafer cutting/post-seal cutting, it detects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency
Applied in post-encapsulation or post-plating processes, it can detect the defects in the chip surface and pin, improving efficiency and yield.
Applied after final test, it can detect appearance defects in encapsulated devices by patented 2D/3D vision inspection system.