|
Project |
Content |
|
Product Type |
6’, 8’, 12’ frame wafer, 2.5D/3D package |
|
2D Inspection Items |
scratches, foreign bodies, dirt, damage, PI discoloration, CP sticking deviation, needle marks are too large and other defects |
|
2D Measurement |
Bump diameter, needle mark coordinates, RDL and TSV metrology, etc |
|
3D Inspection Items |
Bump height , Bump coplanarity |
|
Cassette & Transmission Mode |
8"SMIF , 12" FOUP or combination |
|
Lens & Resolution |
2x?2.75um?/3.5x?1.57um?/ 5x?1.1um?/7.5x?0.73um?/10x?0.55um? |
|
Accuracy |
0.55μm/pixel |
|
Optional and Customized |
Double sided OCR, 3D module, supported by E84 |