A multi functional compact docking unit for existing probers
STANDARD APPLICATIONS:
1. PIA Ink : Inking Defective dies with 100% Inkdot Inspection
2. PIA AOI: Automatic Optical Inspection
3. PIA Tabletop: Standalone tabletop system (Ink or AOI Application)
YOUR BENEFITS
- 100% Inkdot quality control
- Ink splash detection on good dies
- Automatic reinking of inkdot failures
- Wafer specific RGB LED Illumination Settings
- Archiving image of completely inked wafer
- Optional SECS/GEM Compatible interface
TECHNICAL CRITERIAS
- Inkdot size (min/max)
- Inkdot position
- Inkdot shape (Roundness, aspect ratio)
- Ink on pass chip detection
- Individual inspection parameters for edge dies and active area
TECHNICAL COMPONENTS
- 2 Telecentric inspection cameras
- Automatic camera changer
- RGB Illumination
- Inking equipment (Pneumatic or electric)
- Automatic needle tip measurement
- Camera for needle tip visualization
- Door Lock
TECHNICAL SPECIFICATIONS
- Wafer diameter up to 300mm
- Chip size down to 200um
- Ink splash detection down to 30um
- Framed wafers (with automatic expansion compensation)
FOR PROBER VERSION
- Control of prober via GPIB protocol
- PIA replaces prober headplate
- Weight incl. PIA-headplate ~ 80kg
- Headplates 600mm, 640mm, 680mm or customized
- Automatic headplate-hole opening/closing
- Motorized PIA Tliting System