Features:
1.Designed for 3D IC process
2.Excellent bond head design and performance
3.Flexible wafer and substrate handling function
(standard load port?MCLP?EFEM…etc)
4.Data traceability and report function are available
5.Customize equipment communication function is available
Specifications:
1.Wafer size :12″ wafer (w/ frame)
2.Chip size: 1 mm x 1 mm ~ 29 mm x 29 mm[Option]40mm x 40mm ~ 100 mm x 100 mm
3.Chip thickness:25 um ~ 2000 um
4.Bonding accuracy <3 um
5.Bonding force 1N ~ 300 N