Features:
1..High speed 6S inspection solution for chip sorting.
2.Switchable flip function for face down/up application.
3.Large die size range(0.5-50mm) inspection.
4.Flexible load/unload system option for waffle pack/JEDEC tray/tape reel
5.Die thickness measurement optional.
Specifications:
1.Accuracy:X,Y= ± 30μm , θ=± 0.2°
2.Cycle Time:? 0.3 sec/chip (exclude process time)
3.Chip size:0.5mm? 20 mm (option: ~2 x 50mm or customized)
4.Die Thickness:0.10 mm?2 mm (2mil Option)
5.Pick up force: 50~150g
6.Wafer Size:12” Standard (8” Option)
7.Input Load/Unload : Automatic
8. Tray size:2”,3”,4”
9.Output Load/Unload : Automatic
10.Binning Capability :3 bins(Option 6 bins)
11.Topside /Backside insp.:Chipping, Crack, Residue glue , defect size>10um
12.Side wall inspection:Chipping, Crack, defect size>10um
13.Mapping:Easy mapping/File mapping/Barcode auto loading