PVA TEPLA SAM for Semiconductor Application

PVA TEPLA SAM for Semiconductor Application

Application: Semiconductor & Electronics

Non destructive inspection of delamination or void

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Description

PVA TEPLA SAM 302 - VIEW PRODUCT

The possibility of mapping the structure of every sample in a non-destructive manner to detect their structure and connection errors makes our systems important aids in all production processes—not just in the field of semiconductor technology. The areas of application are diverse and range from the front end to the back end.

Our systems enable you to check:

Wafers and bonded wafers
SiC ingots and wafers
Si ingots
MEMS
Die structures
Stach dies
Microprocessors

LED Technology
Flip Chips
Power electronics
Bonded Interfaces
CMOS Image Sensors
Molded Components
Passive Components (Resistors, Capacitors)
Packaging

Symphony Group is a lively Malaysian company build by a highly skilled and motivated team, especially qualified in X-ray, microscope imaging, testing solution and has a strong industrial experience in this field.

Blk-B-G-28, Kompleks Suria Kinrara, Persiaran Kinrara Sek.3, Taman Kinrara Sek 3 47100 Puchong, Selangor Darul Ehsan, Malaysia
+60-3-80700467
+60-3-80749697
[email protected]
symphony-engineering

PVA TEPLA SAM for Semiconductor Application

Application: Semiconductor & Electronics

About Symphony

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