3D XRay CT on Semiconductor TSV and Wire Bond

3D XRay CT on Semiconductor TSV and Wire Bond

Application: Semiconductor & Electronics

5um TSV , Solder Bump Crack and Wire Bonding

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This is an example of observing a Φ5μm TSV using the vertical oblique CT function of U.H.SYSTEM (UHS) 3D X-ray CT XVA-160α?z. https://www.youtube.com/watch?v=BOIpZEFNdCo

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3D XRay CT on Semiconductor TSV and Wire Bond

Application: Semiconductor & Electronics

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