Introducing
Symphony Engineering
We specialize in providing innovative engineering solutions for our clients who are mainly involved in the Semiconductors, E&E, PCBA, Automotive ,General industries and etc.
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WE ARE SYMPHONY

In Symphony we invest in people and with the best team, we have a great business. We are a small professional team of experts, all specialist in our work, and all passionate about doing the best we can.

Our goal is customer's goal

Our target is customer’s target


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RECENT NEWS

We build our growth upon long-term partnerships with major customers and principals.

- A WINNING TEAM -

OUR SERVICES

SOME FACTS AND SERVICES

Symphony Group is unique as we are the company which capable to provide New, Used or Refurbished Equipment, Application & Technical Support, Components and Spare part for full range of imaging solution from optical microscope, to laser scanning microscope to X-Ray.

OUR PRODUCTS

Symphony takes great pride in offering the most comprehensive suite of quantitative nanomechanical test instruments in the market

HW Wafer AOI 5510 - Symphony AOI -

Applied to shipment after wafer cutting/post-seal cutting, it detects um-level defects on 6-12 inch wafers, provides yield feedback and outputs map to optimize efficiency

HW 5010TR and HW 5010TT - Symphony AOI -

Applied after final test, it can detect appearance defects in encapsulated devices by patented 2D/3D vision inspection system.

HW CS5025 - Symphony AOI -

Applied in post-encapsulation or post-plating processes, it can detect the defects in the chip surface and pin, improving efficiency and yield.

Symphony Smart Auto Reel Changer - Symphony Automation -

High-speed, fully automated reel changing system with intelligent sensing and minimal manual intervention - Ideal for SMT and semiconductor packaging lines to enhance efficiency and reduce downtime.

OUR APPLICATIONS

Symphony takes great pride in offering the most comprehensive suite of quantitative nanomechanical test instruments in the market

3D XRay CT on Semiconductor TSV and Wire Bond - Semiconductor & Electronics -

5um TSV , Solder Bump Crack and Wire Bonding

cyberTECH for Wafer Laser Groove Depth and Width Auto Measurement - Semiconductor & Electronics -

Laser Dicing Depth and Width Auto Measurement

Phenom XL for Wire Bond and Whisker Inspection - Semiconductor & Electronics -

Phenom XL provides 100 x 100mm stage with flexibility to inspect wire bond with EDS in either QC, R&D , Production or Failure Analysis

cyberTECHNOLOGY for Life Science Application - Life Science -

Dental Tooth Surface Matching